Sputtering target - "neglected" core consumables

Target is the target of sputtering coating  

Target material is one of the main materials for preparing thin films, which is mainly used in integrated circuits, flat panel displays, solar cells, recording media, intelligent glass, etc., which requires high purity and stability of materials.  

Sputtering target working principle:  Sputtering is one of the main technology of preparation of thin film materials, which makes use of the ion, ion source through accelerating gathered in a vacuum, and the formation of a high speed can ion beam, the bombardment of solid surface, ions and solid surface atomic momentum exchange, from solid surface atomic solid And deposition in the basal surface, as the solid bombarded sputtering target materials.  Target material development trend is: high sputtering rate, grain direction control, large size, high purity metal.  

The target material is welded by "target blank" and "backplane"

(1) The target blank is the target material of high speed ion beam bombardment, which belongs to the core part of sputtering target material, and involves the adjustment of high purity metal and grain orientation.  In the process of sputtering coating, after the target is impacted by ions, its surface atoms are sputtered out and deposited on the substrate to form electronic films.  

(2) the backplane mainly plays the role of fixing sputtering target material, involving welding process.  Because of the low strength of high-purity metal, the sputtering target needs to be installed in a special machine to complete the sputtering process.  The machine is in a high-voltage and high-vacuum environment, so the sputtering target blank of ultra-high purity metal needs to be joined with the backplane through different welding processes, and the backplane needs to have good electrical and thermal conductivity.  

The main coating processes are physical vapor deposition (PVD) and chemical vapor deposition (CVD).  

(1) PVD technology is the mainstream coating method, in which the sputtering process is widely used in semiconductor, display panel.  PVD technology is divided into vacuum evaporation, spatter plating and ion plating.  The three methods have their own advantages and disadvantages: the vacuum evaporation method has no limitation on the substrate quality;  The properties and uniformity of spatter film are better than that of steam film.  The ion plating method has strong ability to wrap around the plating, and the cleaning process is simplified, but it affects the coating quality under high power.  The choice of different methods mainly depends on the product use and application scenario.  

(2) CVD technology mainly generates films through chemical reaction.  One or more gas phase compounds or elements containing film elements are introduced into the reaction chamber at high temperature, and films are generated by chemical reactions on the substrate surface.  

Terminal application:  

1) Semiconductor chip: the dielectric layer, conductor layer and protective layer in the unit device need tantalum, tungsten, copper, aluminum, titanium and other metals.  

2) Flat panel display device: in order to ensure the uniformity of large area film layer, improve productivity and reduce cost, sputtering technology coating requires molybdenum, aluminum, ITO and other materials;  

3) Thin-film solar cells -- the third generation, sputtering coating process is the preferred preparation method, and the target is an indispensable raw material;  

4) Computer memory: magnetic information storage, magneto-optical information storage and all-optical information storage, etc.  In the optical disc, mechanical hard disk and other recording media, need to use chromium base, cobalt base alloy and other metal materials.