Target material​ is one of the main materials for preparing thin films, which is mainly used in integrated circuits, flat panel displays, solar cells, recording media, intelligent glass, etc., which requires high purity and stability of materials. Sputtering target working principle: Sputtering is one of the main technology of preparation of thin film materials, which makes use of the ion Read More »

Choose target material​ types, material and gas (nitrogen, oxygen, acetylene, methane, argon gas, etc.), determine the target material and gas species, and then adjust the gas ratio, the dosage, the sputtering power, sputtering time, processing temperature, the substrate sputtering process parameters, such as temperature, sputtering time, preparation of color film, widely used in decorative coating industry. Read More »

Sputtering target​ is the most important factor to determine the yield of semiconductor. So applied to the semiconductor and the required precision degree, is the highest purity, degree of purity of sputtering target materials and precision will directly affect the performance of semiconductor, the difference of sputtering target materials is the most direct consequences caused semiconductor short circuit Read More »

Metal target Nickel, Ni, titanium, Ti, zinc, Zn, Chromium, Cr, Magnesium, Mg, niobium, Nb, tin, Sn, Aluminum, Al, indium, In, Iron, Fe, zirconium, ZrAl, Titanium-aluminum, TiAl, zirconium, Zr, aluminum-silicon, AlSi, Silicon, Si, Copper, Cu, tantalum, T, A, Ge , Silver target, Ag target, cobalt target, Co target, gold target, Au target, gadolinium target Read More »

Polysilicon is the basic raw material for the information industry and the solar cell industry. It is refined from metallurgical grade silicon processed by quartz sand and used to manufacture crystalline silicon based cell modules.Polysilicon wafer has some cost advantages over monocrystalline silic Read More »