Target material​ is one of the main materials for preparing thin films, which is mainly used in integrated circuits, flat panel displays, solar cells, recording media, intelligent glass, etc., which requires high purity and stability of materials. Sputtering target working principle: Sputtering is one of the main technology of preparation of thin film materials, which makes use of the ion Read More »

As the lightest metal structure material, magnesium​ has broad application prospects in aerospace, automotive, high-speed rail, electronic products and medical and other fields. However, compared with traditional metal materials, magnesium has poor plasticity, difficult deformation processing of profiles and parts, and high process cost. This severely restricts the wide application of magnesium as a structural material. Read More »

In the manufacturing process of OLED, "evaporation" is the essence part but also the difficulty. It refers to a coating technology in which the materials to be evaporated are heated by resistance or electron beam, and the atoms are vaporized by crucible in the vacuum chamber to reach and adhere to the substrate surface under high vacuum condition. Read More »

In the world, people generally "alumina" is divided into two categories: metallurgical grade alumina and non-metallurgical grade alumina. Non-metallurgical grade alumina is also known as multiple varieties of alumina, chemical alumina. Among them, pseudo-boehmite, boehmite, super fine aluminum hydroxide, activated alumina, calcined alumina and corundum are all belong to the chemical alumina this category. Read More »

High purity polysilicon​ material is the basic raw material of information industry and solar photovoltaic power generation industry. Many developed countries regard it as a strategic material. Electronic-grade polysilicon is one of the most basic and main raw materials for manufacturing semiconductor silicon wafers, known as the "food" of the electronic information industry, with purity requirements of 99.999999999% ~ 99.999999999% (9N ~ 11N). Read More »

In the chip industry, sputtering target​ is a necessary raw material for vlSI manufacturing. Which makes use of the ion, ion source through accelerating gathered in the high vacuum, and the formation of a high speed can ion beam, the bombardment of solid surface, ions and solid surface atomic momentum exchange, from solid surface atomic solid and deposition in the basal surface, bombarded solid is sputtering deposition film of raw materials, known as the sputtering target materials. Read More »

Aluminum is a silver-gray metal with a relative mass of 26.98, relative density of 2.55, and a melting point of 685 degrees, a boiling point of 2065 degrees and a latent heat of 323kJ /g. Aluminum is reductive, easy to oxidize and exothermal in the process of oxidation. At rapid oxidation, the heat release is 15.5 kJ /g. Aluminum is a ductile metal and easy to work. The oxide film on the surface of aluminum is transparent and has good chemical stability. Read More »

Chromium alloys have high strength and corrosion resistance, and alloys composed of iron and nickel are commonly known as stainless steel. Nickel chromium is two metal elements, both can be alloyed with iron, aluminum, silicon, carbon, sulfur and other impurities into nickel chromium wire. Nickel - chromium wire has high resistivity and heat resistance, is electric furnace, electric soldering iron, iron and other electric heating elements. Read More »

Black silicon carbide is made of quartz sand, petroleum coke (or coal coke), wood chips and other raw materials in the resistance furnace by high temperature smelting, in the resistance furnace by high temperature smelting, black opaque body, hexagonal crystallization, Mohs hardness is 9.15. Second only to diamond and boron carbide, brittle and sharp performance and a certain electrical conductivity. Read More »

Lithium iron phosphate​ has an olivine structure and is densely packed hexagonally (slightly twisted). LiFePO4 consists of FeO6 octahedron and PO4 tetrahedron to form a spatial skeleton. P occupies the tetrahedron position, while Fe and Li fill the octahedron gap. Fe occupies the coangular octahedron position, and Li occupies the coedal octahedron position. Read More »

Through chemical or physical methods to form a film on the tool surface (that is, coating process), so that the cutting tool to obtain excellent comprehensive cutting performance, so as to meet the requirements of high-speed cutting; Since the advent of hard coating tools in the early 1970s, chemical vapor deposition (CVD) technology and physical vapor deposition (PVD) technology have been developed, which has opened a new chapter in the history of improving the performance of tools. Read More »

Wide Band Gap Semiconductor (WBGS) is a new third generation Semiconductor material developed after the first generation of silicon, germanium and the second generation of gallium arsenide, indium phosphatide materials. Silicon carbide​ (SiC) is the third generation of semiconductor materials outstanding generation 9) table. Silicon carbide technology is mature enough that high-quality 4-inch wafers are commercially available and 6-inch wafers are available. Read More »

Alloy 600(UNS:N06600,EN:2.4816) is a solution reinforced heat and corrosion resistant Alloy with excellent high-temperature corrosion resistance, oxidation resistance, cold and hot working properties, low temperature mechanical properties, and cold fatigue properties. High strength at 650℃, good formability, easy to weld. Suitable for vinyl chloride plant and heating furnace, in the air, the highest service temperature up to 1175℃. Read More »

Silicon nitride​ is a compound synthesized under artificial conditions. Although silicon nitride was synthesized directly more than 140 years ago, it was only remembered as a stable "refractory" nitride. After the Second World War, the rapid development of science and technology, the urgent need for high temperature resistance, high hardness, high strength, corrosion resistant materials. Read More »

Titanium is a chemical element, chemical symbol Ti, atomic number 22, in the periodic table of chemical elements in the fourth period, IVB group. It is a silver-white transition metal characterized by light weight, high strength, metallic luster and resistance to wet chlorine corrosion. The most common compound of titanium is titanium dioxide​, which is used to make white pigments. In the past, titanium ore was mined mainly for titanium dioxide. Read More »