Target material​ is one of the main materials for preparing thin films, which is mainly used in integrated circuits, flat panel displays, solar cells, recording media, intelligent glass, etc., which requires high purity and stability of materials. Sputtering target working principle: Sputtering is one of the main technology of preparation of thin film materials, which makes use of the ion Read More »

Choose target material​ types, material and gas (nitrogen, oxygen, acetylene, methane, argon gas, etc.), determine the target material and gas species, and then adjust the gas ratio, the dosage, the sputtering power, sputtering time, processing temperature, the substrate sputtering process parameters, such as temperature, sputtering time, preparation of color film, widely used in decorative coating industry. Read More »

Magnetron sputtering​ method can be used to prepare a variety of materials, such as metals, semiconductors, insulators, etc. It has the advantages of simple equipment, easy control, large coating area, strong adhesion and so on. Magnetron sputtering development so far, in addition to the advantages of the general sputtering method, but also to achieve high speed, low temperature, low damage. Read More »

Sputtering is the use of high speed ion impact solid sputtering target, so that the surface molecules splash and projected onto the substrate to form a film.The initial kinetic energy of the sputtering ion is about 100 eV.A common plasma gas is argon. Read More »