Target material​ is one of the main materials for preparing thin films, which is mainly used in integrated circuits, flat panel displays, solar cells, recording media, intelligent glass, etc., which requires high purity and stability of materials. Sputtering target working principle: Sputtering is one of the main technology of preparation of thin film materials, which makes use of the ion Read More »

Choose target material​ types, material and gas (nitrogen, oxygen, acetylene, methane, argon gas, etc.), determine the target material and gas species, and then adjust the gas ratio, the dosage, the sputtering power, sputtering time, processing temperature, the substrate sputtering process parameters, such as temperature, sputtering time, preparation of color film, widely used in decorative coating industry. Read More »

Magnetron sputtering​ method can be used to prepare a variety of materials, such as metals, semiconductors, insulators, etc. It has the advantages of simple equipment, easy control, large coating area, strong adhesion and so on. Magnetron sputtering development so far, in addition to the advantages of the general sputtering method, but also to achieve high speed, low temperature, low damage. Read More »

Magnetron sputtering coating is a new physical gas phase coating method, which is to use the electron gun system to emit electrons and focus on the coated material, so that the sputtering atoms follow the momentum conversion principle to fly away from the material with a high kinetic energy to the substrate deposition film. This plated material is called the sputtering target. Read More »