Targets-semiconductor manufacturing materials

Target material  

The target material is the material of making thin film, using the target material bombarded by high-speed charged particles, through different laser (ion beam) and different target material interaction to get different membrane system, to achieve the function of conduction and blocking.  

Therefore, the target is also called "sputtering target". His working principle is to use the ions generated by the ion source to gather and accelerate in vacuum, and bombard the target surface with the formation of high-speed ion beam, resulting in kinetic energy exchange, so that the atoms on the surface of the target are deposited on the base.  

A target is composed of "target blank" and "backplane". The target blank is made of high purity metal and is the target of high speed ion beam bombardment.  

The back plate is connected with the target blank by welding process to fix the target blank, and the back plate must have thermal conductivity.  

Thin film deposition of sputtering target

Thin film deposition is also an essential step, which is divided into PVD (physical vapor deposition) and CVD (chemical vapor deposition).  

Generally speaking, it can be divided into physical deposition and chemical deposition. Physical deposition refers to the use of physical methods to convert the material source into gaseous particles deposited on the substrate under vacuum conditions.  

Common PVD methods include sputtering (DC physical vapor deposition, radio frequency physical vapor deposition, magnetron sputtering, ionized physical vapor deposition) and evaporation (vacuum evaporation, electron beam evaporation).  

Chemical deposition refers to the method of forming thin film by chemical reaction of several gas phase compounds or elements containing thin film elements on the substrate surface.  

Common CVD methods include chemical vapor deposition (atmospheric chemical vapor deposition, low pressure chemical vapor deposition, metallic chemical vapor deposition, photochemical vapor deposition, laser chemical vapor deposition) and atomic layer deposition (ALD deposition can be regarded as variant CVD chemical deposition).  

Sputtering target industry chain

The target industry chain can be generally regarded as four parts, which are metal purification, target manufacturing, sputtering coating and terminal application.  After the target material is extracted from high purity metal and coated by sputtering process, it is applied in chip, flat panel display, solar cell, storage, optics and other fields.  

One of the most stringent technical requirements is metal purification and sputtering coating these two links.  Metal purification means that the irregular metal through chemical electrolysis, thermal decomposition or physical evaporation crystallization, electromigration, vacuum melting and other methods to get more pure, more regular main metal.  

Generally speaking, solar cells and flat panel displays require 4N target material, integrated circuit chips require 6N target material, higher purity.  (4N is 99.99%, 6N is 99.9999%)