Sputtering target why to bind back target

Why to bind back target on sputtering target?  

Sputtering targets are mainly used in electronic information industry, such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc.  It can also be used in glass coating, wear-resistant materials, high temperature corrosion resistance, high-grade decorative products and other industries.  

Bonding refers to bonding a target to a back target with solder.  There are three main ways: crimping, brazing and conductive adhesive.  Brazing is commonly used for target bonding, and indium, tin, and indium tin are commonly used for solders.  Sputtering power is generally less than 20W/㎡.

Why do we bind the back target?  

1. Prevent uneven cracking of targets, such as brittle targets and sintered targets, such as ITO, silica and ceramics;  

2. Save cost and prevent deformation.  If the target is too expensive, make the target thinner and glue the back target to prevent distortion.  

Back target  

1. Oxygen-free copper has good electrical conductivity and thermal conductivity.  

2. Moderate thickness, generally recommended back target thickness of about 3mm.  If it's too thick, it consumes some of the magnetic field strength;  It's too thin and easily deformed.  

The binding process  

1.  Combined pretreatment of the front target and back target surfaces  

2. Place the target and the back target on the welding table and raise the temperature to the welding temperature.  

3. Metallized target and backfired target.  

4. Glue target and back target  

5. Cooling and post-processing