Target material of sputtering's meaning

To repeatedly used in very large scale integrated circuit manufacturing process of Sputtering, Sputtering process of physical vapor deposition (PVD) technology, is one of the main technology of electronic thin film materials preparation, which makes use of the ion, ion source through accelerating gathered in the high vacuum, and the formation of a high speed can ion beam, the bombardment of solid surface,The ions exchange kinetic energy with the atoms on the solid surface, so that the atoms on the solid surface leave the solid and deposit on the substrate surface. The bombarded solid is the raw material for the deposition of thin films by sputtering method, which is called the sputtering target.The following Xiaobian of Xianji Network will introduce the working principle, types, industry chain, industry development status, trend, competition pattern and other information of sputtering target materials in detail.

The working principle of sputtering target

In general, the sputtering target material is mainly composed of the target blank and the back plate, among which the target material is the target material bombarded by high-speed ion beam and belongs to the core part of the sputtering target material. In the sputtering coating process, the target material is hit by ions, and its surface atoms are scattered by sputtering and deposited on the substrate to make electronic films.Due to the low strength of high purity metal, and sputtering target materials need to be installed in a dedicated sputtering process is done in the machine, the machine internal for high voltage, high vacuum environment, therefore, ultra high purity metal sputtering target billet need to joint with back through the different welding process, the back have mainly have the effect of fixed sputtering target material, and need to have good conductive, thermal conductivity.

Classification of sputtering targets

There are many kinds of sputtering target materials, even sputtering target materials of the same material have different specifications. According to different classification methods, sputtering targets can be divided into different categories. The main classification is as follows:

Classified by shape: long target, square target, dartboard;

Classified by chemical composition: metal target (pure metal aluminum, titanium, copper, tantalum, etc.), alloy target (nickel-chromium alloy, nickel-cobalt alloy, etc.), ceramic compound target (oxide, silicide, carbide, sulfide, etc.);

Classified by application field: semiconductor chip target, flat panel display target, solar cell target, information storage target, tool modification target, electronic device target, other target.

Application in the field of the sputtering target materials, semiconductor chip of sputtering target material purity metal materials, internal microstructure set a strict standard, need to master the key technology and through long-term practice in the process of production can be made into products that meet the technological requirements, therefore, semiconductor chip demand for sputtering target materials is the highest, the price also is the most expensive.

Compared with semiconductor chips, flat panel displays and solar cells have slightly lower requirements on the purity and technology of sputtering targets. However, with the increase of the size of target materials, higher requirements are put forward on the welding bonding rate, flatness and other indicators of sputtering targets.In addition, the sputtering target needs to be installed in the sputtering machine to complete the sputtering process. 

The sputtering machine has strong specificity, and many restrictions are set on the shape, size and precision of the sputtering target.