PVD sputtering target's introduction

What is PVD coating target?

Physical vapor deposition (PVD) is a thin-film preparation technique that physically vaporizes the surface of a target into gaseous atoms, molecules, or parts into ions under vacuum conditions.  A film with a specific function is then deposited on the surface of the substrate via a low-pressure gas (or plasma).  The main methods of physical vapor deposition include vacuum evaporation, sputtering deposition, arc plasma plating, ion plating, etc.  PVD film deposition speed, strong adhesion, good diffraction, a wide range of applications.  

Basic principle of PVD coating target  

The basic principles of physical vapor deposition technology can be divided into three processing steps:  

1. Gasification of coating materials, that is, evaporation of coating materials, not similar to sputtering.  

2. Migration of atoms, molecules or ions in electroplating: various reactions occur after collisions of atoms, molecules or ions.  

3. Electroplated atoms, molecules or ions are deposited on the substrate.  

PVD coated target material advantages  

1. Durability PVD coatings are sometimes harder and more resistant to corrosion than other coatings, such as electroplating.  

2. Wide application Almost all types of inorganic coatings and some organic coatings can use a variety of surface treatments for a variety of types of substrates and surfaces.  

3. Because PVD coating processes are carried out in a vacuum, they are more environmentally friendly than other traditional coating technologies, such as electroplating and painting.  

4. Easy cleaning: You can save (reduce) the time and cost of cleaning and polishing ordinary copper (gold) products, and a soft cloth or glass cleaner is enough to clean PVD film.  

5. High quality and a variety of choices :PVD film has a variety of colors, the surface is fine and smooth, with metallic luster, never fade.  Common colors are golden yellow (TiN), bright silver (CrN), purple (TiAlN) and so on.