Magnetron sputtering coating

History of magnetron sputtering coating

Magnetron sputtering, as a very effective method for thin film deposition, has been widely and successfully applied in many fields, especially in the fields of microelectronics, optical thin film and material surface treatment, for thin film deposition and surface coating preparation. Grove first described the physical phenomenon of sputtering in 1852, and sputtering technology began to be applied and developed as a deposition coating method in the 1940s. After the 1960s, with the rapid rise of semiconductor industry, this technology in the integrated circuit production process, used to deposit the metal electrode layer of the transistor in the integrated circuit, was really popularized and widely used.After the emergence and development of magnetron sputtering technology, as well as the reflector used to make CD in the 1980s, the application of magnetron sputtering technology has been greatly expanded, and gradually become a common means of manufacturing many products, and in the last decade, a series of new sputtering technology has been developed.

Principle of magnetron sputtering coating

In the process of electron accelerating towards the substrate under the action of electric field, it collides with argon atoms and ionizes a large number of argon ions and electrons. Under the action of electric field, argon ion accelerates the bombardment of target material, sputtering a large number of target atoms, and the target atoms are deposited on the surface of the substrate to form a film.Under the influence of magnetic field, the secondary electrons are bound to the plasma region of the target surface. Under the action of magnetic field, the secondary electrons move around the target surface in a circle. In the process of movement, they constantly collide with argon atoms and ionize a large number of argon ions to bombard the target.

Magnetron sputtering target material

Target material mainly includes metal target, metal oxide target and so on.According to the shape and size of the target seat processing.

Advantages and disadvantages of magnetron sputtering

Advantages: good process repeatability, high film purity, uniform film thickness, good adhesion.

Disadvantages: the equipment structure is complex, once the sputtering target penetrates, the whole target will be scrapped, so the utilization rate of the target is low.