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Copper Metal (Cu)-Rotary Sputtering Target

  • 7440-50-8
  • Cu
  • 2900RT
  • 99.95%-99.9999%
  • Customized
  • 231-159-6


Copper target material is one of the sputtering targets in vacuum coating industry. It is a product of high purity copper material after series of processing and has specific size and shape of high purity copper material.

Rotary copper target material is tubular, high efficiency, but not easy to process, through high purity copper extrusion, stretch, straightening, heat treatment, machining and other processing procedures can be finally produced copper target products.


Suitable for dc diode sputtering, three pole sputtering, four splash, rf sputtering, to target sputtering, ion beam sputtering, magnetron sputtering, etc., can be plated reflective film, conductive film, semiconductor films, capacitor film, decorative film, protective film, integrated circuits, display, etc., relative to other target material, copper material price is lower, so the copper target material is under the premise that can satisfy the function of the membrane layer of the target material.