Ceramic target material news about application

Ceramic target can be divided into semiconductor related ceramic target, display ceramic target, magnetic recording ceramic target, optical recording ceramic target, superconducting ceramic target, giant magnetoresistance ceramic target and so on.  

Semiconductor - associated ceramic targets (HfO₂, SiO₂, Si3N4, Al₂O₃,MoSi, TaSi, WSi, TiSi, PLZT, ITO (In₂O₃/SnO₂)) are mainly used for gate dielectric films.  Ceramic targets ZNS-Mn, ZNS-TB, ZNS-SM, CAS-EU, SRS-CE, Y₂O ₅, Ta₂O₅, Si3N4, MgO. Suitable for use in thin electroluminescent layer, thin electroluminescent film insulation layer, and disk.

Magnetic recording ceramic targets Al₂O₃, Si3N4, mainly for head, magnetic disc (MO) protection.

Optical recording ceramic rake material Si3N4, SiO₂+ZnS, mainly used in optical disc protective film.

Superconducting ceramic targets YbaCuO and BiSrCaCuO are mainly applied to superconducting thin films.

Large magnetoresistance ceramic targets ZnO₂, Al₂O₃ are mainly used for thin film solar cell Windows.

In₂O₃, LiNbO₃, BaTiO₃, PZT. ZnO, mainly used In solar cells, piezoelectric thin films.

According to chemical composition, ceramic target can be divided into oxide ceramic target, silicide ceramic target, nitride ceramic target, fluoride ceramic target and sulfide ceramic target, etc.  

Oxide ceramic sputtering target is the most common target in advanced ceramic sputtering target.  Oxide ceramics can be made by sintering at high temperatures, in which one or more oxides are the primary components and the other minor oxides are additives.  They are divided into simple oxide ceramics and complex oxide ceramics.  Common sputtering targets of this type include alumina (Al2O3), magnesium oxide (MgO), beryllium oxide (BeO), zirconia (ZrO2) and so on.  Most oxide ceramics have high melting point, excellent insulation, heat resistance, antioxidant and corrosion properties.  Therefore, they can be exposed to high temperature and oxidation environment for a long time, which is worthy of extensive application in engineering field.  

Characteristic requirements of Ceramic material targets  

1. the purity of ceramic target has a great influence on the performance of sputtering film, the higher the purity of ceramic target, the better the uniformity of sputtering film and the consistency of batch product quality.  

2. the density of ceramic target not only affects the deposition rate, the density of sputtering film particles and discharge phenomenon, but also affects the electrical and optical properties of sputtering film.  The denser the target, the lower the particle density of the sputtering film, the weaker the discharge phenomenon, and the better the performance of the film.  In addition, increasing the density and strength of ceramic target can make the target better withstand the thermal stress during sputtering.  

3. the microstructure uniformity of ceramic sputtering target material has a great influence on the film formation rate, the quality and thickness distribution of the deposited film.  Therefore, it is necessary to achieve good uniformity of composition and structure of the target material, which is also one of the important indicators of the quality of ceramic target material.