The Rotatable Sputtering Target

Rotatable sputtering target, or rotatory target, is a commonly used target shape in magnetron sputtering. It is generally cylindrical, with a stationary magnet inside, and a slow magnetic field, which allows the sputtering rate to be uniform and the target utilization rate to be high. Rotating targets are commonly used for coating solar cells, architectural glass, automotive glass, semiconductors, and flat-panel TVs.

Rotatable Sputtering Target

Rotatable sputtering targets, also known as rotatable cathodes or rotating targets, are specialized materials used in a sputtering deposition technique called magnetron sputtering. Sputtering is a physical vapor deposition (PVD) process, a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles, widely used in the semiconductor, electronics, and thin film industries to deposit thin films of various materials onto substrates.

In standard sputtering systems, a stationary sputtering target is used as the cathode, which is bombarded with high-energy ions to release atoms or molecules from its surface. However, in the case of rotatable sputtering targets, the target is mounted on a rotating shaft, allowing it to spin during the sputtering process.

Advantages of using Rotatable Sputtering Target

1). Improved Uniformity: The rotation of the target helps achieve more uniform erosion and deposition across its surface. As the target rotates, different areas of the target are exposed to the ion bombardment, leading to more even erosion and deposition rates. This results in better film thickness uniformity and composition control across the substrate. 2). Increased Target Utilization: With a stationary target, erosion typically occurs in localized areas, leading to grooves or pits on the target surface. By rotating the target, the erosion is spread out over a larger surface area, reducing localized damage and extending the target's lifespan. This increased target utilization helps improve process efficiency and reduces downtime for target replacement. 3). Higher Deposition Rates: The rotational movement of the target can enhance the ionization and sputtering efficiency. The increased sputtering yield allows for higher deposition rates, reducing the overall process time required to achieve the desired film thickness. 4). Enhanced Film Quality: The improved target utilization and uniformity provided by rotatable targets contribute to better film quality. The increased uniformity helps minimize defects, impurities, and stress within the deposited films, resulting in improved electrical, optical, and mechanical properties.

Rotatable Sputtering Target Manufacturing Processes

Sprayed: FUNCMATER provides industry-leading thermal spray rotary targets, providing the best process stability and performance, including production methods such as plasma, arc and cold spray, enabling spray rotary targets with the most advanced density, purity and gas control. The main materials include:: AZO, Cr, CuGa , ITO, Mo, NbOx, Si, SiAl, Sn, TiOx, W alloys, Zn and its alloys (ZnSn and ZnAl), ZnO, ZrOx and ZTO. Cast: The main advantages are high compositional and microstructural consistency and purity control, which contribute to high process yields and long target lifetimes. Cast rotary products include In, InSn, Sn alloys, Zn alloys (ZnAl and ZnSn) and many other materials. Extruded: FUNCAMTER is an established supplier of high-purity extruded Al, Cu, Mo, Nb, Ni alloys (Cr and V), Ta, Ti, Zr, V and other materials. We provide application-specific custom solutions for extruded targets with respect to material characteristics, including purity and grain size. HIP/Sintered: Our products include Cr, NiFe as well as C, Mo and W alloys. FUNCMATER can perform direct hot isostatic pressing on the backing tubes of certain materials, enabling high power use without the use of solder. Bonded: FUNCMATER offers bonding solutions for metal and ceramic rotating targets, using In and elastomer bonding, for a wide variety of materials including AZO, C, Cr, Mo, Si and others.

Leading manufacturer of Rotatable Sputtering Target

Our rotating sputtering targets have a unique combination of properties that provide safe operation and stable processes even at higher sputtering powers

Our production capabilities allow us to manufacture rotatable targets in large sizes: up to 3.9 meters in length and up to 225 mm in diameter.

Our high quality rotatable (cylindrical) targets, even with the "dog bone" profile, are joint-free and have a strong bond (no indium) on the back tube.

These features allow for high power sputtering and enable users to sputter material down to the last millimeter - meaning better material usage and lower cost of ownership than traditional straight cylindrical models.

Our proprietary technology also allows us to reuse backing tubes with minimal material waste for cost-effective solutions.

Rotatable Sputtering Application Area

Rotatable sputtering targets are commonly used in applications where high-quality and large-area thin films are required, such as flat panel displays, architectural glass coatings, solar cells, and magnetic storage media. It's important to note that the design and specifications of rotatable sputtering targets can vary depending on the specific sputtering system and application requirements.

Contact us for more information about rotating targets