Nickel powder's use

Chemical formula: Ni

Particle size: 20nm 50nm (black) 200nm 500nm 1μm 5μm 10μm (gray black) and other optional

Purity: ≥99.9%

Crystal: spherical sheet

Color: black gray black  

What are the compounds of nickel powder?  

Nickel sulfide powder, nickel oxide powder, nickel silide powder, nickel boride powder.  

Use of nickel powder  

1. The magnetic fluid produced by nano-iron, nano-cobalt, nano-nickel and nano-alloy powder has excellent performance and can be widely used in sealing shock absorption, equipment, sound regulation, optical display and other fields.

2. Catalyst: nano nickel, micron nickel powder due to large specific surface area and high activity, nano nickel powder has a strong catalytic effect, can be used for hydrogenation of organic compounds, automobile exhaust treatment, etc.

3. Accelerant: nano-nickel powder added to the solid fuel propellant of the rocket can greatly improve the combustion speed and combustion heat, improve the stability of combustion.

4. Conductive paste: electronic paste is widely used in wiring, packaging, connection and so on in the microelectronics industry, which plays an important role in the miniaturization of micro-electronic devices.  The electronic slurry made of ni, Cu, Al and Ag nano-powders has superior performance, which is beneficial to the further refinement of the circuit.  

5. High performance electrode material: nano-nickel powder supplemented with appropriate process can produce electrode with huge surface area, which can greatly improve the discharge efficiency.

6. Activated sintering additive: nano powder has high energy state due to the large proportion of surface area and surface atoms, and has strong sintering ability at lower temperature. It is an effective sintering additive, which can greatly reduce the sintering temperature of powder metallurgy products and high temperature ceramic products.  

7. Metal and non-metal surface conductive coating treatment: because nano aluminum, nano copper, nano nickel have high activation surface, in the absence of oxygen conditions can be lower than the melting point of the powder coating temperature implementation.  This technology can be applied to the production of microelectronic devices.