What is chemical vapor deposition (CVD)?

What are the main advantages and disadvantages of CVD?

CVD uses one or more gases to chemically react on a heated solid substrate and to coat it with a solid film.

Advantages:  

1. Vacuum degree requirements are not high, even do not need vacuum, such as hot spray coating;  

2. Rapid deposition rate, atmospheric CVD can reach 1μm/min;  

3. Compared with PVD.  Chemical composition or alloy coating is easier to achieve;  

4. The composition of the coating is diversified, such as metal, non-metal, semiconductor, photoelectric materials, diamond film;  

5. Can be in the complex shape of the substrate coating, even into porous ceramics;  

6. Thickness uniformity is good, low-voltage CVD can even plating dozens of chips at the same time.  

Disadvantages:  

1. Thermodynamics and chemical reaction mechanisms are not easily understood or poorly understood;  

2. Need to be carried out at high temperature, some substrate can not withstand, and even coating effect;  

3. The reaction gas may be corrosive, toxic or explosive, so be careful when handling it;  

4. The reaction products may remain on the coating and become impurities;  

5. The shielding of the substrate is difficult.