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12059-14-2
Ni2Si
281400PD
99%
-20 Mesh
235-033-1
Class 9
UN3077
PGIII
Characteristic
Nickel silicides include several intermetallic compounds of nickel and silicon. Nickel silicides are important in microelectronics as they form at junctions of nickel and silicon.
Chemical formula:Ni2Si
Molar mass:145.473 g/mol
Density:7.40 g/cm3
Melting point:1,255 °C (2,291 °F; 1,528 K)
Application
Ni silicides have been widely investigated for contact materials in microelectronic devices. Electroplating is another major use of the metal. nickel silicide/silicon nanowire heterostructures have been used to produce field-effect transistors.
Characteristic
Nickel silicides include several intermetallic compounds of nickel and silicon. Nickel silicides are important in microelectronics as they form at junctions of nickel and silicon.
Chemical formula:Ni2Si
Molar mass:145.473 g/mol
Density:7.40 g/cm3
Melting point:1,255 °C (2,291 °F; 1,528 K)
Application
Ni silicides have been widely investigated for contact materials in microelectronic devices. Electroplating is another major use of the metal. nickel silicide/silicon nanowire heterostructures have been used to produce field-effect transistors.
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