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Color: Black
Form: Spherical
BET: 13.46 (m2/g)
Bulk Density: 0.64 (g/cm3)
High uniformity nano Sn-Bi alloy powder with controllable particle size and Sn-Bi composition can be prepared by gas phase method with variable current laser ion beam. It has high purity, uniform particle size, good spherical shape, good dispersion and easy to be mixed and sintered. Nano-sn-bi alloy has small particle size and low melting point, which can be used in semiconductor materials.
1. As semiconductor materials, low melting point tin bismuth alloy material strength is low, so in the stamping process is not easy to appear strain, scratch and other defects, is conducive to improve the surface quality of stamping parts;
2. As alloy materials, powder metallurgy materials additives, fine grain, dispersion strengthening, change the mechanical properties of materials, etc.
Color: Black
Form: Spherical
BET: 13.46 (m2/g)
Bulk Density: 0.64 (g/cm3)
High uniformity nano Sn-Bi alloy powder with controllable particle size and Sn-Bi composition can be prepared by gas phase method with variable current laser ion beam. It has high purity, uniform particle size, good spherical shape, good dispersion and easy to be mixed and sintered. Nano-sn-bi alloy has small particle size and low melting point, which can be used in semiconductor materials.
1. As semiconductor materials, low melting point tin bismuth alloy material strength is low, so in the stamping process is not easy to appear strain, scratch and other defects, is conducive to improve the surface quality of stamping parts;
2. As alloy materials, powder metallurgy materials additives, fine grain, dispersion strengthening, change the mechanical properties of materials, etc.
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