Gold sputtering of the knowledge

Gold is one of the most beautifully luminescent and valuable metals on Earth because of its ability to throw light, reflect energy and resist tarnishing. PVD or Physical Vapor Deposition Gold Sputtering is commonly used in the watch and jewelry industry to produce coatings that are hard and durable and won’t rub off with constant contact with the skin or clothes and lose it sheen. PVD Gold Sputtering is also used for coating circuit panels and electronic components due to its excellent conductivity, for coating optical fibers, batteries and high end faucets and fixtures. Gold Sputtering processes are invaluable for biomedical implants that serve as radiopaque coatings that are visible in x-rays and lifesaving procedures like coating tissue samples to make them visible for scanning under electron microscopes. 

Gold Sputtering coatings are a thin film deposition process where gold or a gold alloy is bombarded with high energy ions in a vacuum chamber resulting in the gold atoms or molecules being “Sputtered” into the vapor and condensing on the substrate to be coated such as jewelry, circuit boards or medical implants. PVD Gold Sputtering is frequently conducted as a DC Sputtering process which is among the simplest and least expensive types of sputtering equipment. Gold is also commonly applied as a thin film PVD process via Thermal Evaporation Deposition where it is evaporated in a low pressure environment with an electrical resistive heating element, or as Electron-beam Vapor Deposition where the gold is heated with an electron-beam in a high vacuum which then condenses on the substrate to be coated. Gold sputtering The embodiment of the present invention discloses a back-gold sputtering method, including: obtaining a first correspondence between the thickness of the wafer and the number of step-by-step operations; obtaining a second correspondence between the thickness of the wafer and the working power of the sputtering device According to the first correspondence, according to the number of operations corresponding to the thickness of the product wafer, the entire sputtering process is divided into several sputtering steps; according to the second correspondence and the division of the sputtering steps, select The working power corresponding to the thickness of the product wafer, the back gold sputtering is performed on the product wafer, under the selected working power, the number of metal aggregate-like defects in the sputtering process is within the process allowable range; after completing a After the sputtering step, the sputtering process is stopped, and the cooling water is used to cool the sputtering equipment until the entire sputtering process is completed.