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Characteristic
Copper silicide (Cu5Si), also called pentacopper silicide, is a binary compound of silicon with copper. It is an intermetallic compound, meaning that it has properties intermediate between an ionic compound and an alloy. This a solid crystalline material is a silvery solid that is insoluble in water.
Chemical formula:Cu5Si
Molar mass:345.8155 g/mol
Appearance:silver powder
Melting point:825 °C (1,517 °F; 1,098 K)
Application
Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.
Characteristic
Copper silicide (Cu5Si), also called pentacopper silicide, is a binary compound of silicon with copper. It is an intermetallic compound, meaning that it has properties intermediate between an ionic compound and an alloy. This a solid crystalline material is a silvery solid that is insoluble in water.
Chemical formula:Cu5Si
Molar mass:345.8155 g/mol
Appearance:silver powder
Melting point:825 °C (1,517 °F; 1,098 K)
Application
Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.
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