China Enfei successfully developed ultra-thin electrolytic copper foil

    Recently, China Enfei wet electrolytic copper foil high-performance research and development team has successfully developed 4-6 micron ultra-thin dual-photoelectrolytic copper foil products, marking that the company has mastered the production process and equipment of complete electrolytic copper foil product development technology. 

    Electrolytic copper foil, as one of the deep processing products of copper elements, is an important basic raw material in the electronic communication industry.However, faced with the problems of surplus of low-end copper foil products and dependence on imports of high-end electrolytic copper foil products, relevant production technologies need to be improved urgently.At present, the thickness of ultra-thin copper foil produced by domestic manufacturers is mainly 6~9 microns, tensile strength is 300~450 mepa, elongation is more than 3%, and the surface profile Rz is less than 2 microns.China um Philippines high-performance electrolytic copper foil team using independent research and development design and patented technology gave birth to foil machine and a new electrolytic copper foil electrolyte formula, has developed less than 6 microns, minimum of 4 micron ultra-thin double-sided light copper foil products, surface roughness of copper foil, various properties such as tensile performance, elongation accord with the standard of performance of the existing electrolytic copper foil.The ultra-thin electrolytic copper foil trialed by the research and development team is compact, uniform, smooth and pinhole free of copper crystallization, with surface roughness Ra less than 0.35 microns and Rz less than 2 microns. The tensile strength and elongation of the ultra-thin copper foil with 4 microns can reach up to 408 mepa and up to 9.5%.

    From electrolytic copper foil team after years of efforts, the electrolyte formulation and production technology of copper foil products, through the bottleneck of electrolytic copper foil product development - important node, such as electrolytic copper foil device through their professional limitation, from scratch, self-reliance, the key device of electrolytic copper foil production -- foil machine for independent design and development.At present, the company has applied for 4 related invention patents.

    The successful development of China Enfei ultra-thin electrolytic copper foil fully highlights the company's outstanding advantages in combining engineering expertise with high-tech material research and development, and is another breakthrough in the field of high-tech content new materials.