Overview of four kinds of sputtering targets commonly used in four fields

High purity sputtering target, including aluminum target, titanium target, tantalum target, tungsten titanium target, etc.  Sputtering target mainly involves four fields: flat panel display, semiconductor, storage and solar cell.  

Aluminum target

High purity aluminum and its alloys are one of the most widely used conductive film materials.  In its application field, the fabrication of VLSI chips requires the highest purity of the sputtering target metal, usually as high as 99.9995%, and the metal purity of flat panel displays and solar cells is slightly lower.  

Titanium Target

Titanium is one of the most commonly used barrier film materials (corresponding conductive layer material is aluminum) in vlSI chips.  The titanium target will be used in conjunction with the titanium ring during pre-chip manufacturing.  The main function is to assist the sputtering process of titanium target, which is mainly used in the field of ultra-large scale integrated circuit chip manufacturing.  

Tantalum target

As the demand for consumer electronic products such as smart phones and tablets explodes, the demand for high-end chips increases significantly, making tantalum a hot mineral resource. However, the scarcity of tantalum resources makes the high purity tantalum target expensive, which is mainly used in large-scale integrated circuits and other fields.  

Titanium tungsten target materials

Tungsten titanium alloy has low electron mobility, stable thermo-mechanical properties, good corrosion resistance and good chemical stability.  In recent years, tungsten titanium alloy sputtering target has been used as the contact layer material of semiconductor chip gate circuit.  In addition, tungsten and titanium targets can also be used as barrier layers in metal connections of semiconductor devices.  Used in high temperature environments, mainly for vlsI and solar cells.  

Ultra-high purity metals and sputtering targets are important components of electronic materials.  The sputtering target industry chain is mainly composed of metal purification, target manufacturing, sputtering film and terminal application, among which target manufacturing and sputtering are the key links of the whole sputtering target industry chain.