Article List

• Silicon carbide (SiC)：third generation semiconductor material

  Based on silicon devices on the design and development has undergone many generations of the structure and process optimization and renewal, is gradually close to the limit of the silicon material, based on the potential to improve the performance of silicon devices become more and more small to gallium nitride, silicon carbide​ as a representative of the third generation of semiconductor have excellent physical properties of materials in order to further improve the performance of the power electronics device provides a bigger space.

  News February 07, 2022
• Boride target and related parameters

  LaB6 target material, melting point 2230℃, density 4.7g/cm3, resistivity 15μ ω ·cm, Vickers hardness 27.7 Gpa. TiB2 target, melting point 2980℃, density 4.5g/cm3, resistivity 9~15μ ω ·cm, Vickers hardness 33.5 Gpa. ZrB2 target material, melting point 3040℃, density 6.1g/cm3, resistivity 7-10 μ ω ·cm, Vickers hardness 22.5 Gpa.

  News January 27, 2022
• What are the requirements of 3D printing on the performance of metal powder?

  What conditions do metal powders need to meet in order to meet the requirements of 3D printing materials? Ceramic inclusions will significantly reduce the performance of the final product, and these inclusions generally have a high melting point and are difficult to be sintered, so no ceramic inclusions must be in the powder.

  News January 28, 2022
• What are the material requirements for evaporation source in vacuum coating?

  Generally, the material and shape of the evaporation source should be considered. The general requirements of the evaporation source material​ are: The high melting point Because the evaporation temperature of the evaporating material (the temperature of the equilibrium vapor pressure of 1.3Pa) is mostly between 1000~2000℃, therefore, the melting point of the evaporating source material should be higher than this temperature.

  News January 26, 2022
• Silicon nitride ceramics' properties

  Silicon nitride​ (Si3N4) is a kind of ceramic material with high melting point and high hardness and chemical inertness. Hot-pressed silicon nitride, in particular, is one of the hardest substances in the world. Silicon nitride ceramics have low thermal expansion coefficient and high thermal conductivity, so they have excellent thermal shock resistance.

  News January 25, 2022
• Ceramic targets-what are the types of them?

  According to the application, it can be divided into semiconductor associated ceramic target​, display ceramic target, magnetic recording ceramic target, optical recording ceramic target, superconducting ceramic target, giant magnetoresistance ceramic target, etc. Semiconductor association ceramic target material (HfO, the SiO, Si3N4, MoSi, slipped, WSi, TiSi, PLZT, ITO, is mainly used in gate dielectric film.

  News January 24, 2022
• Nanomaterials' properties

  Nanomaterials​ refer to ultrafine materials with a grain size of nanometer level (1 m). Their sizes are between molecules, atoms and bulk materials. They generally refer to tiny solid powders in the range of 1 ~ 100nm. Nanomaterial is a kind of third kind of solid material which is different from both crystalline and amorphous state.

  News January 21, 2022
• Titanium dioxide film's application

  Titanium dioxide ​(TiO2) is a hard and chemically resistant white titanium oxide. Titanium dioxide (TiO2) sputtering target can be used to obtain high quality titanium dioxide thin film, which has been widely used in various applications due to its coating characteristics. Titanium dioxide film provides opacity and durability while helping to ensure paint life and paint surface protection.

  News January 20, 2022
• Rare earth nanomaterials' application

  Rare earth elements​ themselves have abundant electronic structures and exhibit many optical, electric and magnetic properties. After nanocrystallization, rare earth exhibits many characteristics, such as small size effect, high specific surface effect, quantum effect, strong optical, electrical and magnetic properties, superconductivity, high chemical activity, etc.

  News January 19, 2022
• How is metal powder made for 3D printing?

  The preparation methods of metal powder can be divided into reduction method, electrolysis method, grinding method, atomization method and so on. At present, argon atomization and plasma rotating electrode are the two most advanced pulverizing processes in China. Argon atomization powder making method is to use the fast flowing argon flow to impact the metal liquid, break it into fine particles, and then condense into solid powder.

  News January 18, 2022