What materials can you use with e-beam evaporation?

Electron beam evaporation can prepare thin films from metals, alloys, metal oxides, etc. as source materials, such as aluminum, nickel, iron, silicon, aluminum oxide, silicon dioxide, titanium dioxide, zirconium dioxide, gallium telluride, etc.

Electron beam evaporation

Electron beam evaporation is a kind of physical vapor deposition (PVD) technology and an important coating process. Electron beam evaporation is the use of high-energy electron beams to bombard the source material under vacuum conditions to heat, evaporate and gasify it, then transport it to the substrate, and condense on the surface of the substrate to form a thin film. Electron beam evaporation is an upgraded process of traditional resistance heating evaporation technology, which solves the problem that the source material and the film are in direct contact with each other and are easy to mix.

In the electron beam evaporation equipment, the source material is placed in a water-cooled crucible, which can greatly reduce the probability of the reaction between the source material and the crucible wall, thereby ensuring the quality of the film; multiple crucibles can be installed in the same equipment, and can evaporate multiple times at the same time. A variety of different source materials; electron beam evaporation can produce high-melting point substances into thin films due to the bombardment of the source material by a high-energy electron beam. In general, electron beam evaporation has the characteristics of wide selection of raw materials, high-purity thin films, fast film forming speed, and controllable film thickness.

Scope of application

Electron beam evaporation coating is suitable for precision machinery, tools, aerospace, container and transportation equipment, biomedical equipment, precision optical instruments, special electronic components and high-performance parts required in different industries.

Commonly used electron beam evaporation metal materials

Advantages of Electron Beam Evaporation

Compared with resistance heating evaporation technology, electron beam evaporation has the advantages of high thermal efficiency, high beam current density, fast evaporation speed, high film quality, and more accurate control of thickness; compared with vacuum sputtering technology, electron beam evaporation has the advantages of forming The thin film basically does not cover the target range, and usually only deposits on the characteristics of the target surface. Therefore, electron beam evaporation is one of the mature vacuum coating technologies at present.

Disadvantages of Electron Beam Evaporation

1. Improper control of electron beam and electron flow will cause material decomposition or dissociation, the former will cause absorption and the latter will cause accumulated charge on the substrate and cause discharge damage on the membrane surface.

2. The size and scanning method of the electron beam required for different materials are different, so if different coating materials are used in the coating process, they must be replaced from time to time.

3. For sublimation materials or materials that will evaporate after being slightly dissolved, such as SiO2, the evaporation rate and evaporation distribution are unstable, so it has a great influence on the uniformity and property of film thickness. If SiO2 is changed from granular to bulk and the shape of electron beam scanning is adjusted, better distribution stability is expected to be obtained.

Application Scenario

Electron beam evaporation can be used to manufacture optical films, thermal barrier coatings, wear-resistant coatings, corrosion-resistant coatings, hard coatings, etc., widely used in semiconductors, electronics, communications, optical instruments, industrial equipment, automobiles, solar cells, aviation Aerospace, building materials and other fields.