Top five alloy sputtering target common preparation methods
Publish Time: 2022-07-25 Origin: Site
Alloy sputtering target has higher requirements than other materials. In addition to general requirements such as purity, size, impurity content and defect control, there are also special requirements such as surface roughness, composition and tissue uniformity, impurity (oxide) content and size. So in the preparation process of sputtering alloy target, its method is very important, so what are the common preparation methods of sputtering alloy target?
Five sputtering target materials preparation methods
1. Smelting method
The alloy raw material is melted according to a certain ratio, and then the alloy solution is poured into the mold to form the ingot, which is made into the target material by mechanical processing.
2. Powder metallurgy method
The powder metallurgy method is to melt the alloy raw materials with a certain ratio, pour them into ingots and then break them. The powder formed by crushing is formed by isostatic pressing and then sintered at high temperature to form the target material.
3. Strong current heating method
Strong current heating method is the use of high current device, the use of high current to make two or more raw materials powder heating, and then apply pressure, so that a variety of metal reaction to form alloy target.
4. Hot isostatic sintering method
Hot isostatic pressing sintering is a process of sintering and densification of ceramic powder, billet or prefired body through the joint action of high temperature and isotropic high pressure gas. A variety of metal powders are mixed, and then after powder loading and cold isostatic prepressing, degassing process, hot isostatic pressing molding, and then sintering and processing to obtain the alloy target.
5. Hot pressing sintering method
Hot pressing sintering is a sintering method in which the dry powder is filled into the model, and then the molding and sintering are completed simultaneously by pressing and heating from the uniaxial direction. Due to the simultaneous heating and compression of hot pressing sintering, the powder is in a thermoplastic state, which is conducive to the process of particle contact diffusion and mass transfer, so the molding pressure is only 1/10 of the cold pressing. It can also reduce sintering temperature, shorten sintering time, so as to resist grain growth, get fine grain, high density and good mechanical and electrical properties of the product. Without adding sintering auxiliaries or molding auxiliaries, ultra-high purity ceramic products can be produced.