Sputtering targets have the important roles

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes. The process is repeatable and can be scaled up from small research and development projects, to production batches involving medium to large substrate areas. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer projectile mass must match target mass, so for sputtering light elements neon is also used and for heavy elements krypton or xenon. Reactive gases are used to sputter compounds. The chemical reaction can occur on the target surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process but allow experts a large degree of control over the growth and microstructure of the film.

Many products commonly used today have a coating created through sputtering targets. These coatings include: SemiconductorsMost modern day electronics incorporate essential components which have been produced with tantalum sputtering targets. These include microchips, memory chips, print heads, flat panel displays as well as others. Glass CoatingSputtering targets are used to produce low-radiation coated glass – also known as Low-E glass – which is commonly used in building construction because of its ability to save energy, control light, and for aesthetics. Solar Cell CoatingDemands for renewable energy are on the rise. Third generation, thin-film solar cells are prepared using sputter coating technology.