Sputtering target material: semiconductor chip material king

What is sputtering target?

In the chip industry with high technology, sputtering target is a necessary raw material for vlSI manufacturing. Which makes use of the ion, ion source through accelerating gathered in the high vacuum, and the formation of a high speed can ion beam, the bombardment of solid surface, ions and solid surface atomic momentum exchange, from solid surface atomic solid and deposition in the basal surface, bombarded solid is sputtering deposition film of raw materials, known as the sputtering target materials. Target material is the core material in sputtering process.  

The unit device of integrated circuit is composed of substrate, insulating layer, dielectric layer, conductor layer and protective layer. Among them, the dielectric layer, conductor layer and even protective layer need to use sputtering coating process, so the sputtering target is one of the core materials for preparing integrated circuit. The coating targets in the field of integrated circuit mainly include aluminum target, titanium target, copper target, tantalum target, tungsten-titanium target, etc., which require high purity of target, generally more than 5N(99.999%).  

Target classification: There are many kinds of sputtering target, according to different classification standards, there can be different categories. Sputtering targets can be classified by shape, chemical composition and application field.  

Sputtering target: although the volume is small, the core technology  

High purity metal sputtering target material is mainly used in wafer manufacturing and advanced packaging process. Taking chip manufacturing as an example, we can see that from a silicon chip to a chip needs to go through seven production processes, namely ThermalProcess, Photo-lithography, Etch, IonImplant, DielectricDeposition, CMP, Metalization, each link needs to use equipment, materials and process corresponding to one by one. Sputtering target is used in the process of "metallization", through the thin film deposition equipment using high-energy particles to bombard the target and then form a specific function of the metal layer on the silicon chip, such as conductive layer, barrier layer, etc.