Planar target and rotating target's differences

The common sputtering target in the market mainly includes plane sputtering target and rotating sputtering target

For planar target, its main advantages are simple structure, strong versatility, film uniformity and good repeatability.Its biggest disadvantage is low target utilization rate, generally only about 20%;When the target in the glow region (magnetic field distribution region) is consumed to a certain extent, the strip-shaped pits will be formed, which makes the target thinner.When the pit depth reaches a certain value, the target is no longer usable.

Compared with planar targets, the main advantages of rotating targets are their compact structure and higher target utilization rate, which means that rotating targets can solve the problem of low utilization rate of planar targets.However, the rotating target also has some inevitable disadvantages. When sputtering, there are many glow rings on the entire surface of the target, which cannot form continuous strip glow.Therefore, when a large area of film is coated, the uniformity of the film surface is poor and it is difficult to meet the requirements, which is the biggest disadvantage of rotating target.

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