High purity tungsten target material (chip manufacturing)

Application of tungsten sputtering target

High purity tungsten target is an important substrate for the transition of tungsten oxide film in semiconductor devices. Due to the high melting point of tungsten, tungsten targets are mainly prepared by powder metallurgy. The preparation method includes the purity of 99.999% or more, particle size of 3.2 4.2μm tungsten powder for uniform mixing, placed in the vacuum heat treatment furnace for pre-degassing, and then into hydrogen, continue heating degassing steps; Degassed tungsten powder through vacuum hot pressing to complete a sintering step; The second sintering process is completed by hot isostatic press after the first sintering. By grinding the whole surface of the second sintered tungsten plate through machining, high purity tungsten target material with purity of 99.999% and density of 99% and above for semiconductor was obtained, which has the advantages of high purity, high density and low resistance.  

The purity of tungsten target in semiconductor semiconductor integrated circuit has a high requirement, generally the target purity should be above 99.999%. At the same time, the density of the target also has an important effect on the coating process and the performance of the film, the density of the target not only affects the deposition rate, the density of the sputtering film particles and the discharge phenomenon, but also affects the electrical and optical properties of the sputtering film. The denser the target, the lower the density of the sputtering film particles, the weaker the discharge phenomenon, and the better the performance of the film.  

Only a few companies in the United States and Japan have mastered the manufacturing technology for tungsten targets used in chip manufacturing. Fortunately, with the support of the "Made in China 2025" policy, more and more talented people have returned to China to start their own businesses, bringing with them advanced technological experience and creating a better atmosphere for RESEARCH and development. This not only ended the history of metal target material having to rely on imports, but also entered the world's first echelon in this field.