Applications of Titanium Nitride Sputtering in Nanoimprint Lithography

Titanium nitride (TiN) is a hard, wear-resistant material that has a wide range of applications, including in nanoimprint lithography (NIL). TiN sputtering is used to deposit thin films of TiN onto substrates for use in NIL, which is a high-resolution patterning technique used in nanofabrication. Here are some of the applications of TiN sputtering in nanoimprint lithography: 

Anti-sticking layer of Titanium Nitride Titanium Sputtering Target

In NIL, an anti-sticking layer is required to prevent the patterned resist from adhering to the mold during the imprinting process. TiN is an ideal material for this purpose due to its high hardness and low surface energy. TiN sputtering can be used to deposit a thin layer of TiN as an anti-sticking layer on the substrate. 

Titanium Nitride Titanium Sputtering Target Etch mask

TiN is also used as an etch mask in the NIL process. After imprinting, the resist is removed, leaving behind a patterned TiN layer on the substrate. The TiN layer can then be used as a mask for subsequent etching steps to transfer the pattern to the underlying material. 

Hard mask of Titanium Nitride Titanium Sputtering Target

TiN can also be used as a hard mask for patterning the substrate directly. TiN sputtering is used to deposit a thick TiN layer onto the substrate, which is then patterned using standard lithography techniques. The TiN layer acts as a hard mask, protecting the underlying material from etching and ensuring high fidelity pattern transfer. Overall, TiN sputtering plays a critical role in the fabrication of high-resolution patterns in nanoimprint lithography.