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English| Image | Product Name | Purity | CAS | Specification | Inquiry |
|---|---|---|---|---|---|
 | Copper Metal (Cu)-Sputtering Target | 99.95%-99.995 % | 7440-50-8 | 3 inch dia x 0.25 inch th.etc | Inquire |
 | Ultrafine Copper Metal (Cu)-Powder | 99.5%, 99.9%, 99.99% ,99.999% | 7440-50-8 | 7.0-12.0μm | Inquire |
 | Electrolytic Copper Metal (Cu)-Powder | ≥99.5% | 7440-50-8 | -200~-300mesh | Inquire |
 | Spherical Copper Metal (Cu)-Powder | ≥99.9% | 7440-50-8 | 20nm, 50nm, 1μm， 5μm | Inquire |
 | Copper Metal (Cu)-Powder | 99.5%-99.999% | 7440-50-8 | Irregular / Spherical / Dendritic | Inquire |
| Irregular Copper Metal (Cu)-Powder | >99.6% | 7440-50-8 | -100 ~ -325mesh | Inquire |
 | Copper Metal (Cu)-Foil | 99.99%，99.999 % | 7440-50-8 | 3 inch dia x 1 mm.etc | Inquire |
 | Copper metal (Cu)-Pellets | 99.996% | 7440-50-8 | Dia 6.35x6.35mm | Inquire |
